The Model 4526 AutoStepback Wedge Bonder is used with aluminum wire, gold wire and ribbon. It is especially appropriate for your high quality applications requiring tight control of This chapter describes the K& S 4500 Series Manual Wire Bonders MANUAL WIRE BONDERS MPP.
The MPP range of manual wire bonders includes manual and semiautomatic systems for gold ball, wedge and ribbon bonding.
The iBond5000Ball is an advanced manual wire bonder for gold ball bonding (copper optional) used throughout research& development laboratories, Universities, Wire Bonders such as Automatic Ball Bonders, Manual Wedge Bonders, Wire Bonding, Automatic Wedge Bonders, Manual Ball Bonders from Used, Surplus, Refurbished Semiconductor Manufacturing Equipment, Parts, Accessories and Supplies For Sale, Auctioned and Wanted. We manufacture wire bonders, die bonders, die attach, epoxy die attach, pull tester, and shear tester for the semiconductor industry.
Levels of automation vary from completely manual to fully automatic. Search for used wire bonder. Find K& S, Palomar, Nikon, Omega, Panasonic, Eagle, Hesse, Screen, Leica, MB, Siemens for sale on Machinio. Buysell new and used bonders for semiconductor applications at LabX.
Auctions and For Sale Listings. The iBond5000 Series integrates the proven 4500 manual wire bonder mechanical design with an advanced graphical user interface. The iBond5000 Series includes 3 basic models: Wedge, Ball and Dual. The iBond5000Wedge is an advanced wedge bonder used for process development, production, research or added manufacturing support. Find great deals on eBay for manual wire bonder. Shop with confidence.